WUS Printed Circuit (Kunshan) Co., Ltd.

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Product details

Hybrid Products

Hybrid/Partial hybrid PCB’s

Production since Y2002

Up to 18 Layers

Innovative & Cost effective

designs

Experience with various

material mix

Power Amplifier for RF

application

BP(Backplane)
LC(Line Card)
Server Products
ANT(Antenna)
HDI(Higth Density Interconnec)
Hybrid Products
Heat sinks(Metal-backed PCB)
Heavy Copper

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